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HV Fuse update#18

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Lakshay983 wants to merge 3 commits into
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fuse_update
Open

HV Fuse update#18
Lakshay983 wants to merge 3 commits into
mainfrom
fuse_update

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Summary of Changes

Hello, I'm Gemini Code Assist1! I'm currently reviewing this pull request and will post my feedback shortly. In the meantime, here's a summary to help you and other reviewers quickly get up to speed!

This pull request, titled "HV Fuse update," encompasses a broader set of hardware design modifications for the ActivePrecharge RevB board. The primary intent was to update the HV fuses, but the changes extend to a general refresh of the PCB layout, including component repositioning, adjustments to drill holes, and updates to the associated production files. These updates ensure the design reflects the latest component choices and layout optimizations, while also streamlining development by ignoring KiCad lock files.

Highlights

  • KiCad Library Updates: The shared KiCad library subproject was updated, and a new 'UTSVT-Power' library was added to the footprint library table.
  • PCB Layout and Component Changes: Significant updates were made to the PCB layout, including changes to component footprints, positions, and drill hole definitions. Notably, fuses F1 and F2 were updated to a new 'HV-Fuse' footprint, and connector J7 was removed.
  • Production File Regeneration: Gerber and drill files were regenerated, reflecting the layout changes and an unusual KiCad version downgrade from 9.0.7 to 9.0.6. The Bill of Materials (BOM) and Component Placement List (CPL) were also updated accordingly.
  • Git Ignore Update: KiCad lock files (*.lck) are now ignored by Git to prevent unnecessary version control tracking.

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Changelog
  • .gitignore
    • Added '*.lck' to the ignore list.
  • Hardware/KiCAD-Sharepoint
    • Updated the subproject commit hash to reflect changes in the shared KiCad library.
  • Hardware/fp-lib-table
    • Added a new KiCad library entry for 'UTSVT-Power'.
  • Hardware/jlcpcb/gerber/ActivePrecharge RevB-EdgeCuts.gbr
    • Updated KiCad generation software version from 9.0.7 to 9.0.6 and refreshed the creation timestamp.
  • Hardware/jlcpcb/gerber/ActivePrecharge RevB-MaskBottom.gbr
    • Updated KiCad generation software version and creation timestamp.
    • Adjusted aperture definitions and component coordinates.
  • Hardware/jlcpcb/gerber/ActivePrecharge RevB-MaskTop.gbr
    • Updated KiCad generation software version and creation timestamp.
    • Adjusted aperture definitions and modified component coordinates and logo layer.
  • Hardware/jlcpcb/gerber/ActivePrecharge RevB-NPTH.drl
    • Updated KiCad generation software version and creation timestamp.
    • Modified non-plated through-hole coordinates.
  • Hardware/jlcpcb/gerber/ActivePrecharge RevB-PTH.drl
    • Updated KiCad generation software version and creation timestamp.
    • Modified drill tool definitions and adjusted plated through-hole coordinates.
  • Hardware/jlcpcb/production_files/BOM-ActivePrecharge RevB.csv
    • Updated fuse F1 and F2 footprints to 'HV-Fuse' and adjusted their quantities.
    • Removed connector J7 from the Bill of Materials.
  • Hardware/jlcpcb/production_files/CPL-ActivePrecharge RevB.csv
    • Updated F1 and F2 footprints and coordinates.
    • Removed connector J7.
    • Changed LOGO1 layer from 'top' to 'bottom'.
    • Adjusted coordinates and rotation for various other components.
  • Hardware/~ActivePrecharge RevB.kicad_pcb.lck
    • Removed the KiCad PCB lock file.
Activity
  • No specific activity has been recorded for this pull request yet.
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Code Review

This pull request updates the high-voltage fuses on the Active Precharge board. This includes changing the footprints for F1 and F2, which is reflected in the updated Bill of Materials (BOM) and Component Placement List (CPL). The Gerber and drill files have been regenerated accordingly. Additionally, a KiCad lock file is now ignored, which is a good practice. My main feedback is on the generated CSV files (BOM and CPL), which are currently unsorted, making them difficult to review. Sorting them would significantly improve maintainability.

Comment on lines +1 to +29
Comment,Designator,Footprint,LCSC,Quantity
1.5A,F3,FUSE_3568,C5249699,1
10,"R13,R14",R_0603_1608Metric_Pad0.98x0.95mm_HandSolder,C313648,2
100k,"R20,R22",R_0603_1608Metric_Pad0.98x0.95mm_HandSolder,C25803,2
100nF,"C10,C14,C16,C20",C_0603_1608Metric_Pad1.08x0.95mm_HandSolder,C14663,4
10k,"R10,R11,R12,R16,R18,R5,R6,R7,R8,R9",R_0603_1608Metric_Pad0.98x0.95mm_HandSolder,C25804,10
10nF,"C2,C3",C_0603_1608Metric_Pad1.08x0.95mm_HandSolder,C57112,2
10uF,"C1,C4",C_0805_2012Metric_Pad1.18x1.45mm_HandSolder,C440198,2
1k,"R15,R17,R19",R_0603_1608Metric_Pad0.98x0.95mm_HandSolder,C21190,3
1nF,"C11,C17",C_0603_1608Metric_Pad1.08x0.95mm_HandSolder,C1588,2
1uF,"C12,C13,C15,C18,C19,C5,C6,C7,C8,C9",C_0603_1608Metric_Pad1.08x0.95mm_HandSolder,C15849,10
2.49k,"R21,R23",R_0603_1608Metric_Pad0.98x0.95mm_HandSolder,C2930072,2
330,"R1,R2,R3",RES_PWR263S-35-3300F,C1356602,3
AMC1350DWVR,"IC1,IC2",SOIC127P1150X280-8N,C4990162,2
LED,"D4,D5,D6,D7,D8",LED_0603_1608Metric_Pad1.05x0.95mm_HandSolder,C7371904,5
LT1963AEST-3.3#TRPBF,U2,VREG_LT1963AEST-3.3_TRPBF,C459918,1
RM-3.305S,PS1,CONV_RM-3.305S,C7050226,1
RSX068MP2STR,D1,RSX068MP2STR,C20109379,1
TLV9002QDRQ1,U1,SOIC-8_3.9x4.9mm_P1.27mm,C22392181,1
VSSAF522-M3/H,"D2,D3",SODFL5026X125N,C20039242,2
HVGND,TP1,TestPoint_Keystone_5005-5009_Compact,,1
HV+,J5,PinHeader_1x01_P2.54mm_Vertical,,1
MainContactor,J3,Molex_Nano-Fit_105309-xx04_1x04_P2.50mm_Vertical,,1
PrechargeContactor,J2,Molex_Nano-Fit_105309-xx04_1x04_P2.50mm_Vertical,,1
1.5A,F2,HV-Fuse,,1
ExportConnector,J4,Molex_Nano-Fit_105310-xx12_2x06_P2.50mm_Vertical,,1
HV-,J6,PinHeader_1x01_P2.54mm_Vertical,,1
1.5A,F1,HV-Fuse,,1
HVConnector,J1,Molex_Nano-Fit_105309-xx03_1x03_P2.50mm_Vertical,,1

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medium

This file has been significantly reordered, which makes it difficult to track changes. To improve maintainability and simplify future reviews, please consider sorting the contents of this CSV file alphabetically by the Designator column. This would group related components (like F1, F2, F3) and make diffs much cleaner.

Comment on lines +1 to +67
Designator,Val,Package,Mid X,Mid Y,Rotation,Layer
C1,10uF,C_0805_2012Metric_Pad1.18x1.45mm_HandSolder,156.4,-85.4,90.0,top
C10,100nF,C_0603_1608Metric_Pad1.08x0.95mm_HandSolder,156.78,-97.69,180.0,top
C11,1nF,C_0603_1608Metric_Pad1.08x0.95mm_HandSolder,157.7,-101.6525,-90.0,top
C12,1uF,C_0603_1608Metric_Pad1.08x0.95mm_HandSolder,156.78,-99.21,180.0,top
C13,1uF,C_0603_1608Metric_Pad1.08x0.95mm_HandSolder,169.8475,-97.35,180.0,top
C14,100nF,C_0603_1608Metric_Pad1.08x0.95mm_HandSolder,169.8475,-95.8,180.0,top
C15,1uF,C_0603_1608Metric_Pad1.08x0.95mm_HandSolder,156.176667,-112.91,-90.0,top
C16,100nF,C_0603_1608Metric_Pad1.08x0.95mm_HandSolder,156.7775,-110.46,180.0,top
C17,1nF,C_0603_1608Metric_Pad1.08x0.95mm_HandSolder,157.7,-112.9125,-90.0,top
C18,1uF,C_0603_1608Metric_Pad1.08x0.95mm_HandSolder,156.7775,-108.94,180.0,top
C19,1uF,C_0603_1608Metric_Pad1.08x0.95mm_HandSolder,169.8475,-107.11,0.0,top
C2,10nF,C_0603_1608Metric_Pad1.08x0.95mm_HandSolder,185.06,-106.2,0.0,top
C20,100nF,C_0603_1608Metric_Pad1.08x0.95mm_HandSolder,169.8475,-108.66,0.0,top
C3,10nF,C_0603_1608Metric_Pad1.08x0.95mm_HandSolder,185.06,-107.8,0.0,top
C4,10uF,C_0805_2012Metric_Pad1.18x1.45mm_HandSolder,153.01,-85.4,-90.0,top
C5,1uF,C_0603_1608Metric_Pad1.08x0.95mm_HandSolder,179.19,-107.0,90.0,top
C6,1uF,C_0603_1608Metric_Pad1.08x0.95mm_HandSolder,167.0625,-85.92,0.0,top
C7,1uF,C_0603_1608Metric_Pad1.08x0.95mm_HandSolder,167.0625,-84.39,0.0,top
C8,1uF,C_0603_1608Metric_Pad1.08x0.95mm_HandSolder,161.98,-85.92,180.0,top
C9,1uF,C_0603_1608Metric_Pad1.08x0.95mm_HandSolder,156.178333,-101.6525,-90.0,top
D1,RSX068MP2STR,RSX068MP2STR,121.75,-121.25,90.0,top
D2,VSSAF522-M3/H,SODFL5026X125N,189.5,-81.8,-90.0,top
D3,VSSAF522-M3/H,SODFL5026X125N,189.0,-113.05,-90.0,top
D4,LED,LED_0603_1608Metric_Pad1.05x0.95mm_HandSolder,153.01,-81.5775,90.0,top
D5,LED,LED_0603_1608Metric_Pad1.05x0.95mm_HandSolder,186.0775,-84.19,180.0,top
D6,LED,LED_0603_1608Metric_Pad1.05x0.95mm_HandSolder,161.98,-82.79,180.0,top
D7,LED,LED_0603_1608Metric_Pad1.05x0.95mm_HandSolder,189.72,-118.0075,-90.0,top
D8,LED,LED_0603_1608Metric_Pad1.05x0.95mm_HandSolder,167.0625,-81.28,180.0,top
F1,1.5A,HV-Fuse,116.0,-102.885,-90.0,top
F2,1.5A,HV-Fuse,127.0,-102.885,-90.0,top
F3,1.5A,FUSE_3568,180.27,-88.89,0.0,top
IC1,AMC1350DWVR,SOIC127P1150X280-8N,165.0,-101.395,0.0,top
IC2,AMC1350DWVR,SOIC127P1150X280-8N,165.0,-112.7,0.0,top
J1,HVConnector,Molex_Nano-Fit_105309-xx03_1x03_P2.50mm_Vertical,122.5,-84.195,90.0,top
J2,PrechargeContactor,Molex_Nano-Fit_105309-xx04_1x04_P2.50mm_Vertical,195.935,-85.19,0.0,top
J3,MainContactor,Molex_Nano-Fit_105309-xx04_1x04_P2.50mm_Vertical,195.935,-114.75,0.0,top
J4,ExportConnector,Molex_Nano-Fit_105310-xx12_2x06_P2.50mm_Vertical,194.57,-100.0,0.0,top
J5,HV+,PinHeader_1x01_P2.54mm_Vertical,136.55,-124.6,0.0,top
J6,HV-,PinHeader_1x01_P2.54mm_Vertical,136.55,-74.9,0.0,top
LOGO1,Dr. Hallock,Hallock_Image_Tiny,181.227069,-87.569857,0.0,bottom
PS1,RM-3.305S,CONV_RM-3.305S,164.93,-88.225,180.0,top
R1,330,RES_PWR263S-35-3300F,141.5125,-81.166398,0.0,top
R10,10k,R_0603_1608Metric_Pad0.98x0.95mm_HandSolder,173.2375,-114.6,0.0,top
R11,10k,R_0603_1608Metric_Pad0.98x0.95mm_HandSolder,173.4375,-100.95,0.0,top
R12,10k,R_0603_1608Metric_Pad0.98x0.95mm_HandSolder,173.2375,-116.14,0.0,top
R13,10,R_0603_1608Metric_Pad0.98x0.95mm_HandSolder,181.66,-106.2,180.0,top
R14,10,R_0603_1608Metric_Pad0.98x0.95mm_HandSolder,181.66,-107.8,180.0,top
R15,1k,R_0603_1608Metric_Pad0.98x0.95mm_HandSolder,154.59,-81.5775,90.0,top
R16,10k,R_0603_1608Metric_Pad0.98x0.95mm_HandSolder,186.0675,-82.59,180.0,top
R17,1k,R_0603_1608Metric_Pad0.98x0.95mm_HandSolder,161.98,-84.4,0.0,top
R18,10k,R_0603_1608Metric_Pad0.98x0.95mm_HandSolder,188.11,-118.0125,-90.0,top
R19,1k,R_0603_1608Metric_Pad0.98x0.95mm_HandSolder,167.0625,-82.86,0.0,top
R2,330,RES_PWR263S-35-3300F,141.5125,-93.716398,0.0,top
R20,100k,R_0603_1608Metric_Pad0.98x0.95mm_HandSolder,153.135,-101.6525,-90.0,top
R21,2.49k,R_0603_1608Metric_Pad0.98x0.95mm_HandSolder,154.656667,-101.6525,90.0,top
R22,100k,R_0603_1608Metric_Pad0.98x0.95mm_HandSolder,153.13,-112.9,-90.0,top
R23,2.49k,R_0603_1608Metric_Pad0.98x0.95mm_HandSolder,154.653333,-112.9125,90.0,top
R3,330,RES_PWR263S-35-3300F,141.5125,-106.266398,0.0,top
R4,330,RES_PWR263S-35-3300F,141.5125,-118.816398,0.0,top
R5,10k,R_0603_1608Metric_Pad0.98x0.95mm_HandSolder,173.4375,-99.416667,180.0,top
R6,10k,R_0603_1608Metric_Pad0.98x0.95mm_HandSolder,173.4375,-97.88,0.0,top
R7,10k,R_0603_1608Metric_Pad0.98x0.95mm_HandSolder,173.2375,-113.06,180.0,top
R8,10k,R_0603_1608Metric_Pad0.98x0.95mm_HandSolder,173.2375,-111.52,0.0,top
R9,10k,R_0603_1608Metric_Pad0.98x0.95mm_HandSolder,173.4375,-102.49,180.0,top
U1,TLV9002QDRQ1,SOIC-8_3.9x4.9mm_P1.27mm,175.665,-107.0,180.0,top
U2,LT1963AEST-3.3#TRPBF,VREG_LT1963AEST-3.3_TRPBF,155.3,-91.5,-90.0,top

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medium

Similar to the BOM file, this component placement list has been completely rewritten, making it hard to review the specific changes in component positions, rotations, and layers. For better maintainability, please sort this file by the Designator column. This will make future changes much easier to identify and verify.

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