EDispense 是一套智能 PCB 焊膏点胶（/印刷）系统，集成机器视觉、自适应点胶控制与协同热过程管理，实现高速、高一致性与高可靠性的焊膏沉积，服务于电子装联。
EDispense is an intelligent PCB solder paste dispensing system that integrates machine vision, adaptive dispensing control, and coordinated thermal process management to achieve high-speed, high-consistency, and reliable solder deposition for electronic assembly.