Skip to content

ViennaPS-3.5.0

Compare
Choose a tag to compare
@tobre1 tobre1 released this 30 Apr 07:18
· 14 commits to master since this release
bd1bd33

Major Changes

  • DirectionEtching changed to DirectionalProcess to allow positive and negative rates
  • SF6/O2 etching model has been generalized to a plasma etching model. HBr/O2 etching model was added based on the plasma etching model
  • New process models based on rates grid and interpolation

What's Changed

New Contributors

Full Changelog: v3.4.0...v3.5.0