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| 1 | +// Copyright 2014-2018 ETH Zurich and University of Bologna. |
| 2 | +// Copyright and related rights are licensed under the Solderpad Hardware |
| 3 | +// License, Version 0.51 (the “License”); you may not use this file except in |
| 4 | +// compliance with the License. You may obtain a copy of the License at |
| 5 | +// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law |
| 6 | +// or agreed to in writing, software, hardware and materials distributed under |
| 7 | +// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR |
| 8 | +// CONDITIONS OF ANY KIND, either express or implied. See the License for the |
| 9 | +// specific language governing permissions and limitations under the License. |
| 10 | +// |
1 | 11 | // Author: Florian Zaruba, ETH Zurich |
2 | 12 | // Date: 05.07.2017 |
3 | 13 | // Description: Wrap of AXI to MEM adapter |
4 | 14 | // |
5 | | -// |
6 | | -// Copyright (C) 2017 ETH Zurich, University of Bologna |
7 | | -// All rights reserved. |
8 | | -// |
9 | | -// This code is under development and not yet released to the public. |
10 | | -// Until it is released, the code is under the copyright of ETH Zurich and |
11 | | -// the University of Bologna, and may contain confidential and/or unpublished |
12 | | -// work. Any reuse/redistribution is strictly forbidden without written |
13 | | -// permission from ETH Zurich. |
14 | | -// |
15 | | -// Bug fixes and contributions will eventually be released under the |
16 | | -// SolderPad open hardware license in the context of the PULP platform |
17 | | -// (http://www.pulp-platform.org), under the copyright of ETH Zurich and the |
18 | | -// University of Bologna. |
19 | | -// |
20 | 15 |
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21 | 16 | module axi_mem_if_wrap #( |
22 | 17 | parameter AXI4_ADDRESS_WIDTH = 64, |
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